Resistor, method of manufacturing the same, and board having the same

ABSTRACT

A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2014-0152411 filed on Nov. 4, 2014, with the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

TECHNICAL FIELD

The present disclosure relates to a resistor, a method of manufacturingthe same, and a board having the same.

BACKGROUND

A resistor having a chip shape is suitable for implementing preciseresistance, and serves to adjust the flow of current and a voltage dropin a circuit.

When a resistor is damaged by external impacts (surges, staticelectricity, or the like) in a circuit design including the resistor anda defect (short-circuit) occurs, all currents of a power supply flow inan integrated circuit (IC), and thus, secondary damage may occur in thecircuit.

In order to prevent such a phenomenon, using a plurality of resistors indesigning a circuit maybe considered. However, in the circuit design asdescribed above, a mounting area of a board may be increased.

Particularly, in mobile devices which have gradually been miniaturizedand had precision implemented therein, an increase in a mounting area ofa board is not preferable in view of circuit stability. Therefore,research into a resistor capable of more effectively adjusting a currentflowing in the circuit has been required.

SUMMARY

An aspect of the present disclosure may provide a resistor, a method ofmanufacturing the same, and a board having the same.

According to an aspect of the present disclosure, a resistor mayinclude: a base substrate; a resistance layer disposed on one surface ofthe base substrate; and first to third electrode layers disposed on theresistance layer. The electrode layers may be disposed on the resistancelayer to increase an area of the resistance layer. In addition,non-uniformity of overlapping areas of the electrode layers and theresistance layer may be reduced.

According to another aspect of the present disclosure, a method ofmanufacturing a resistor may include: preparing a base substrate;forming a resistance layer on one surface of the base substrate; andforming first to third electrode layers to cover portions of theresistance layer, wherein the electrode layers are formed on theresistance layer, such that R-drift generated in a manufacturing processmay be decreased even in the case that a resistance paste containsglass.

According to another aspect of the present disclosure, a board having aresistor may include: the resistor as described above; and a circuitboard on which the resistor is mounted. When the resistor is mounted ona board, connectivity and adhesive strength between electrode padsdisposed on the circuit board and terminals of the resistor may beimproved.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view illustrating a resistor according to anexemplary embodiment in the present disclosure;

FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1;

FIG. 3 is a cross-sectional view illustrating a resistor according to amodified exemplary embodiment in the present disclosure;

FIG. 4 is a flowchart illustrating a method of manufacturing a resistoraccording to another exemplary embodiment in the present disclosure;

FIGS. 5A and 5B are plan views illustrating the method of manufacturinga resistor according to another exemplary embodiment in the presentdisclosure;

FIGS. 6A and 6B are plan views illustrating a method of manufacturing aresistor according to a modified exemplary embodiment in the presentdisclosure;

FIG. 7 is a perspective view illustrating a board having a resistoraccording to another exemplary embodiment in the present disclosure;

FIG. 8 is a cross-sectional view taken along line B-B′ of FIG. 7; and

FIG. 9 is a cross-sectional view illustrating a board having a resistoraccording to a modified exemplary embodiment in the present disclosure.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings.

The disclosure may, however, be embodied in many different forms andshould not be construed as being limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of thedisclosure to those skilled in the art.

In the drawings, the shapes and dimensions of elements maybe exaggeratedfor clarity, and the same reference numerals will be used throughout todesignate the same or like elements.

In the accompanying drawings, W, T, and L directions refer to a widthdirection, a thickness direction, and a length direction of a basesubstrate, respectively.

Resistor

FIG. 1 is a perspective view illustrating a resistor 100 according to anexemplary embodiment in the present disclosure, and FIG. 2 is across-sectional view taken along line A-A′ of FIG. 1.

Referring to FIGS. 1 and 2, the resistor 100 according to the exemplaryembodiment may include a base substrate 110, a resistance layer 120,first to third terminals 131 to 133 disposed on the resistance layer120.

The base substrate 110, provided to support the resistance layer 120 andsecure strength of the resistor 100, is not particularly limited. Forexample, an aluminum substrate, an insulating substrate, or the like,may be used as the base substrate 110.

Although not limited thereto, the base substrate 110 may be formed as athin plate having a rectangular parallelepiped shape while being formedof an alumina material of which a surface is anodized to thereby beelectrically insulating.

Further, as the base substrate 110 is formed of a material havingexcellent heat conductivity, the base substrate 110 may serve as a heatdiffusion path by which heat generated in the resistance layer 120during operating of the resistor is emitted externally.

The resistance layer 120, disposed on one surface of the base substrate110, may include a first resistance portion connected to the first andthird terminals 131 and 133 to form resistance and a second resistanceportion connected to the second and third terminals 132 to 133 to formresistance.

According to the exemplary embodiment, the first and second resistanceportions maybe formed as a single integrated resistance layer.

Although not limited, the resistance layer 120 may contain Ag, Pd, Cu,Ni, a Cu—Ni based alloy, a Ni—Cr based alloy, a Ru oxide, a Si oxide, Mnand a Mn based alloy, or the like, as a main ingredient, and containvarious materials depending on a required resistance value.

The first resistance portion may be formed between the first and thirdterminals 131 and 133 to adjust a current flowing in a circuit, and thesecond resistance portion may be formed between the second and thirdterminals 132 and 133 to adjust the current flowing in the circuit. Thefirst and second resistance portions may use the third terminal 133 as acommon terminal.

A circuit formed on a board may use a resistor in order to adjust acurrent, and may use two or more resistors or a resistor array in whicheach of the resistance portions is connected to a pair of independentterminals in order to prevent the circuit from being damaged due to adamage of the resistor by external impacts (surges, static electricity,or the like). However, in a case of using two or more resistors or theresistor array according to the related art, a mounting area may beincreased.

According to the exemplary embodiment, a single resistor 100 may includethree terminals 131 to 133 and two resistance portions disposed betweentwo terminals, such that space-utilization efficiency may be improved bydecreasing an area of a board on which the resistor is disposed ascompared to a case of using two resistors each including a singleresistance portion, or the resistor array in which each of theresistance portions is connected to the pair of independent terminals,thereby implementing miniaturization and precision in a device using theresistor 100 having the aforementioned structure.

That is, a three-terminal resistor 100 may be composed of two resistanceportions, a single common terminal 133, and two respective uniqueterminals 131 and 132 of the first and second resistance portions, whichresults in substantially decreasing the number of terminals by one,whereby the resistor 100 may be miniaturized.

In the resistor 100 according to the exemplary embodiment, depending ona resistance value of one of the first and second resistance portionsdetermined by trimming, a resistance value of the other resistanceportion may be determined by continuously trimming the other resistanceportion.

Trimming, an operation such as cutting for finely adjusting theresistance value, or the like, maybe an operation of determining aresistance value set in each of the resistance portions at the time ofdesigning a circuit.

According to the exemplary embodiment, errors in resistance values maybedecreased as compared to a case of using two resistors or a resistorarray.

The first to third terminals 131 to 133 may include first to thirdelectrode layers 131 a to 133 a disposed on the resistance layer 120,respectively, and include first to third plating layers 131 b to 133 bdisposed on the first to third electrode layers, respectively.

For example, as illustrated in FIG. 2, the first terminal 131 mayinclude the first electrode layer 131 a and the first plating layer 131b, the second terminal 132 may include the second electrode layer 132 aand the second plating layer 132 b, and the third terminal 133 mayinclude the third electrode layer 133 a and the third plating layer 133b.

The first to third electrode layers 131 a to 133 a may be disposed to bespaced apart from each other on one surface of the resistance layer 120,and the third electrode layer 133 a may be disposed between the firstand second electrode layers 131 a and 132 a.

Although not limited, the first to third electrode layers 131 a to 133 amay be formed by a method of applying a conductive paste for forming aconductive electrode on the resistance layer. In this case, as anapplication method, a screen printing method, or the like, may be used.

The first to third electrode layers 131 a to 133 a may be formed of amaterial which is different from that of the resistance layer 120 asdescribed above. For example, copper, nickel, platinum, or the like, maybe used therefor, and if necessary, a material which is the same as thatof the resistance layer may be used.

Further, in the resistor 100 according to the exemplary embodiment,after the resistance layer 120 is formed on one surface of the basesubstrate 110, the first to third electrode layers 131 a to 133 a areformed on the resistance layer 120, thereby forming the first to thirdterminals 131 to 133. In this case, an area of the resistance layer maybe increased as compared to a case of forming electrode layers on a basesubstrate and then forming a resistance layer to overlap the electrodelayers.

According to the exemplary embodiment, the area of the resistance layer120 may be increased by forming the electrode layer on the resistancelayer 120 after forming the resistance layer 120, such that powercharacteristics of the resistor 100 may be increased, and overlappingareas between the resistance layer 120 and each of the first to thirdelectrode layers 131 a to 133 a may become constant, thereby reducingresistance value distribution (non-uniformity).

Further, according to the exemplary embodiment, the resistance layer 120may be formed of a resistance paste, wherein the resistance paste maycontain glass. The glass contained in the resistance paste is notuniformly distributed in the resistance paste but sinks downwardly whilethe resistance paste is sintered after printing the resistance paste onthe base substrate, such that the glass is mainly distributed in aregion of the resistance layer adjacent to the base substrate 110.

According to the exemplary embodiment, on the basis of a virtual centerline of the resistance layer in the thickness direction, a content ofglass in a region adjacent to the base substrate is higher than acontent of glass in the remaining half-region of the resistance layer inthe thickness direction.

The glass may hinder flow of the current in the resistance layer, and ina case of forming a resistance layer by applying a resistance paste toan electrode layer after forming the electrode layer on a basesubstrate, unlike the exemplary embodiment, glass contained in theresistance paste may move toward an interface between the electrodelayer and the resistance layer during sintering, thereby decreasing amovement path of the current through the interface between the electrodelayer and the resistance layer, and hindering movement of the current.In a case in which glass hinders movement of a current as describedabove, R-drift, indicating a change in a resistance value, may beincreased during the sintering.

However, in a case of disposing the resistance layer on the basesubstrate, and then disposing the electrode layer on the resistancelayer as in the exemplary embodiment, glass may mainly be distributed ina region adjacent to an interface of the resistance layer and the basesubstrate while the resistance paste is sintered, thereby improvingadhesive strength between the base substrate and the resistance layer.

Further, an amount of glass disposed at an interface of the resistancelayer and the electrode layer may be decreased, such that R-drift maynot be excessively high.

According to the exemplary embodiment in the present exemplaryembodiment, a protection layer 140 for protecting the resistance layer120 from external impacts may be disposed on a surface of the resistancelayer 120 on which the first to third electrode layers 131 a to 133 aare not disposed.

Although not limited, the protection layer 140 may be formed of asilicone (SiO₂) or glass material and may be formed on the resistancelayer 120 by over-coating.

In a case of disposing the electrode layers 131 a to 133 a on theresistance layer 120 as in the exemplary embodiment, with the protectionlayer 140 disposed on the resistance layer 120, the first to thirdterminals 131 to 133 may protrude further than the protection layer 140,such that it may be easy for the terminals 131 to 133 to contactelectrode pads disposed on a board at the time of mounting the resistoron the board. Further, in a case of disposing the electrode layers 131 ato 133 a on the resistance layer 120 as in the exemplary embodiment, acontact area between a mounting surface of the board and the terminalsmay be increased due to an increase in an exposure area of the terminalsat the time of mounting the resistor on the board, such that adhesivestrength between the resistor and the board may be improved.

FIG. 3 is a schematic cross-sectional view illustrating a resistor 100′according to a modified exemplary embodiment in the present disclosure.

As illustrated in FIG. 3, according to the modified exemplaryembodiment, a resistance layer 120 including first and second resistancelayers 121 and 122 may be disposed on a base substrate 110, and first tothird electrode layers 131 a to 133 a may be disposed on the resistancelayer 120, but first and second resistance portions may be formed of tworesistance layers disposed to be spaced apart from each other.

The first resistance portion may be formed of the first resistance layer121 connected to the first and third electrode layers, and the secondresistance portion may be formed of the second resistance layer 122connected to the second and third electrode layers.

According to the modified exemplary embodiment, the first to thirdelectrode layers 131 a to 133 a are not entirely disposed on theresistance layer 120, but portions of the first to third electrodelayers 131 a to 133 a may be disposed on the resistance layer 120, andthe other portions thereof may be disposed on the base substrate 110.

For example, as illustrated in FIG. 3, the first electrode layer 131 amay cover one end portion of the first resistance layer 121 in thelength direction and a portion of one surface of the base substrate 110adjacent to one end portion of the first resistance layer 121 in thelength direction, and the second electrode layer 132 a may cover one endportion of the second resistance layer 122 in the length direction and aportion of one surface of the base substrate 110 adjacent to one endportion of the second resistance layer 122 in the length direction.

Further, the third electrode layer 133 a may cover adjacent end portionsof the first and second resistance layers 121 and 122 among end portionsof the first and second resistance layers 121 and 122 in the lengthdirections, and a portion of one surface of the base substrate 110 onwhich the first and second resistance layers are exposed to be spacedapart from each other.

In a case in which the first to third electrode layers are not entirelydisposed on the resistance layer but portions thereof are disposed onthe base substrate and portions thereof are disposed on the resistancelayer as in the modified exemplary embodiment, when an electrode pastefor forming an electrode layer contains glass, the glass mainly movestoward interfaces between the electrode layers and the base substraterather than interfaces between the electrode layers and the resistancelayer, such that R-drift generated in a manufacturing process of aresistor may be decreased.

Further, according to the modified exemplary embodiment, adhesivestrength of the electrode layer may be improved by bringing theelectrode layer and the base substrate into direct contact with eachother.

According to the exemplary embodiment, the first to third plating layers131 b to 133 b may be formed on the first to third electrode layers 131a to 133 a, respectively, in order to mount the resistor on a board.

According to the exemplary embodiment, first and second rear-surfaceelectrodes 131 d and 132 d may be selectively disposed on the othersurface of the base substrate to face the first and second electrodelayers 131 a and 132 a. In a case in which the first and secondrear-surface electrodes 131 d and 132 d are disposed on the othersurface of the base substrate 110 as described above, the first andsecond electrode layers 131 a and 132 a and the first and secondrear-surface electrodes 131 d and 132 d may offset force applied to thebase substrate 110 by the resistance layer during the sintering, suchthat warpage of the base substrate by the resistance layer may beprevented.

Although not limited, the first and second rear-surface electrodes 131 dand 132 d may be formed by printing a conductive paste.

According to the exemplary embodiment, a pair of end-surface electrodes131 c and 132 c, respectively connected to the first and secondelectrode layers, may be disposed on both end surfaces of a multilayerbody formed by disposing the base substrate 110, the resistance layer120, and the first to third electrode layers 131 a to 133 a.

The multilayer body may selectively include the first and secondrear-surface electrodes 131 d and 132 d as described above.

In a case in which the multilayer body includes the first and secondrear-surface electrodes 131 d and 132 d, the pair of end-surfaceelectrodes 131 c and 132 c may be disposed to connect the firstelectrode layer 131 a and the first rear-surface electrode 131 d to eachother and connect the second electrode layer 132 a and the secondrear-surface electrode 132 d to each other.

The pair of end-surface electrodes 131 c and 132 c may be formed by amethod of sputtering a conductive material forming the end-surfaceelectrodes 131 c and 132 c on the end surfaces of multilayer body.

In a case in which the first and second electrode layers 131 a and 132 aare formed to have a width narrower than that of the base substrate 110,both end portions of the first and second electrode layers 131 a and 132a may be reinforced during the forming of the end-surface electrodes 131c and 132 c.

In a case in which the resistor 100 according to the exemplaryembodiment includes the rear-surface electrodes 131 d and 132 d and theend-surface electrodes 131 c and 132 c, plating layers 131 b and 132 bmay be formed on the rear-surface electrodes and the end-surfaceelectrodes.

For example, a first plating layer 131 b may be formed to cover thefirst electrode layer 131 a, the first rear-surface electrode 131 d, andthe end surface electrode 131 c connecting the first electrode layer 131a and the first rear-surface electrode 131 d to each other, and a secondplating layer 131 b may be formed to cover the second electrode layer132 a, the second rear-surface electrode 132 d, and the end surfaceelectrode 132 c connecting the second electrode layer 132 a and thesecond rear-surface electrode 132 d to each other.

According to the exemplary embodiment, the area of the resistance layermay be increased by forming the electrode layer on the resistance layer,such that power characteristics of the resistor maybe improved, and theoverlapping areas between the electrode layer and the resistance layersmay be constant, thereby decreasing resistance value distribution.

Further, since the electrode layer is disposed on an upper surface ofthe resistance layer, even in the case that the protection layer isformed on the resistance layer, it may be easy to secure a step betweenthe protection layer and the terminal, and even in the case that theresistance paste contains glass, R-drift generated in a manufacturingprocess may be decreased.

Method of Manufacturing Resistor

FIG. 4 is a flowchart illustrating a method of manufacturing a resistoraccording to another exemplary embodiment in the present disclosure, andFIGS. 5A and 5B are plan views illustrating operations of the method ofmanufacturing a resistor according to the exemplary embodiment.

Referring to FIG. 4, the method of manufacturing a resistor according tothis exemplary embodiment may include preparing a base substrate (S1),forming a resistance layer on one surface of the base substrate (S2),and forming first to third electrode layers to cover portions of theresistance layer (S3).

Descriptions of features in the method of manufacturing a resistoraccording to this exemplary embodiment which are the same as those ofthe resistor according to the previous exemplary embodiment describedabove will be omitted.

First, as illustrated in FIG. 5A, after a base substrate 110 is prepared(S1), a resistance layer 120 may be formed on one surface of the basesubstrate 110 (S2), wherein the resistance layer 120 may be formed byprinting a resistance paste.

As illustrate in FIG. 5A, the base substrate 110 may be prepared to havea size allowing a plurality of resistors to be formed thereon.Thereafter, the base substrate 110 may be cut along cutting lines C1 andC2, thereby forming individual resistors.

Alternatively, unlike the drawings, the resistance layer 120 may bedisposed to be continuously formed in the length direction of the basesubstrate 110, and cut along the cutting line C1 to thereby be dividedinto individual resistance layers.

Next, as illustrated in FIG. 5B, first to third electrode layers 131 ato 133 a may be formed on the resistance layer 120 (S3).

As illustrated in FIG. 5B, the first to third electrode layers may beformed to be individually spaced apart from each other.

Alternatively, unlike the drawings, the second electrode layer 132 a maybe formed integrally with a first electrode layer 131 a of an individualresistor adjacent thereto along the cutting line C1, and divided intofirst and second electrode layers of respective resistors at the time ofcutting the base substrate along the cutting line C1.

Next, the method of manufacturing a resistor may further includeperforming a trimming operation of measuring resistance values of firstand second resistance portions disposed between the first to thirdelectrode layers on the basis of individual resistors formed after thecutting and adjusting the resistance values.

Then, the method of manufacturing a resistor may further include forminga protection layer on exposed portions of the resistance layer that isnot covered by the first to third electrode layers.

Next, the method of manufacturing a resistor may further include cuttingthe base substrate on which the resistance layer, the first to thirdelectrode layers, and the protection layer are formed along the cuttingline C1 and then forming end-surface electrodes.

The end-surface electrodes may be formed by a sputtering method.

Thereafter, the method of manufacturing a resistor may further includecutting the base substrate 110 on which the resistance layer 120, thefirst to third electrode layers 131 a to 133 a, the protection layer,conductive resin electrodes, and the end-surface electrodes are formedalong the cutting line C2 and then forming first to third plating layers131 b to 133 b on the first to third electrode layers.

FIGS. 6A and 6B are plan views illustrating operations in a method ofmanufacturing a resistor according to a modified exemplary embodiment inthe present disclosure.

First, as illustrated in FIG. 6A, after abase substrate 110 is prepared,a resistance layer 120 may be formed on one surface of the basesubstrate 110, wherein the resistance layer may be formed by printing aresistance paste.

A cut body obtained by cutting the base substrate along cutting lines C1and C2 in FIG. 6A may form a single resistor, and the resistance layer120 may be formed of two resistance layers distinguished from each otherwithin the single resistor.

Next, as illustrated in FIG. 6B, first to third electrode layers may beformed on the resistance layers so that the first to third electrodelayers 131 a to 133 a are partially in directly contact with the basesubstrate 110.

In the present modified exemplary embodiment, descriptions overlappingthose of the method of manufacturing a resistor according to theprevious exemplary embodiment described above will be omitted.

Board Having Resistor

FIG. 7 is a perspective view illustrating a board having a resistoraccording to another exemplary embodiment in the present disclosure, andFIG. 8 is a cross-sectional view taken along line B-B′ of FIG. 7.

Referring to FIG. 7, a board 200 having a resistor according to thepresent exemplary embodiment may include a resistor 100 and a circuitboard 210 of which an upper surface is provided with first to thirdelectrode pads which are disposed to be spaced apart from each other.

The resistor 100 may include a base substrate, a resistance layerdisposed on one surface of the base substrate, first and secondelectrode layers disposed to be spaced apart from each other andcovering portions of the resistance layer, and a third electrode layerdisposed between the first and second electrode layers to be spacedapart from the first and second electrode layers and covering a portionof the resistance layer.

Since descriptions of the features of the resistor 100 overlap thedescriptions of those of the resistor according to the previousexemplary embodiment, details thereof will be omitted.

FIG. 9 is a cross-sectional view illustrating a board 200′ having aresistor according to a modified exemplary embodiment in the presentdisclosure. Since a description of the resistor mounted in the board200′ illustrated in FIG. 9 overlaps the description of the resistor 100′according to the modified exemplary embodiment described above, detailsthereof will be omitted.

An electronic circuit may be formed on the circuit board 210, and anintegrated circuit (IC) for a specific operation or for control of anelectronic device, or the like, may be formed thereon, such that acurrent supplied from a separate power supply may flow freely.

In this case, the circuit board 210 may include various wiring lines ormay further include different kinds of semiconductor elements such as atransistor, or the like. In addition, the circuit board 210 may bevariously composed. That is, if necessary, the circuit board 210 mayinclude a conductive layer, a dielectric layer, or the like.

The first to third electrode pads 211 to 213, disposed to be spacedapart from each other on the circuit board 210, may be connected to thefirst to third terminals of the resistor.

The first to third terminals may be electrically connected to theelectronic circuit through the first to third electrode pads, such thatthe first and second resistance portions formed between the first tothird terminals may be connected to the electronic circuit.

As set forth above, according to exemplary embodiments in the presentdisclosure, a resistor having excellent space-utilization efficiencywhen being mounted on a board, having reduced non-uniformity inresistance value, and having strong power, a method of manufacturing thesame, and a board having the same may be provided.

Further, according to exemplary embodiments, the resistor capable ofdecreasing changes in a resistance value generated in the manufacturingprocess and improving adhesive strength between the elements in theresistor, the method of manufacturing the same, and the board having thesame may be provided.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A resistor comprising: a base substrate; aresistance layer disposed on one surface of the base substrate; firstand second electrode layers disposed to be spaced apart from each otherand covering portions of the resistance layer; and a third electrodelayer disposed between the first and second electrode layers to bespaced apart from the first and second electrode layers and covering aportion of the resistance layer.
 2. The resistor of claim 1, wherein thefirst to third electrode layers are disposed on one surface of theresistance layer.
 3. The resistor of claim 1, wherein the resistancelayer comprises: a first resistance portion connected to a firstterminal including the first electrode layer and a third terminalincluding the third electrode layer to form resistance; and a secondresistance portion connected to a second terminal including the secondelectrode layer and the third terminal to form resistance, and the firstand second resistance portions are formed integrally with each other. 4.The resistor of claim 1, wherein the resistance layer comprises: a firstresistance portion connected to a first terminal including the firstelectrode layer and a third terminal including the third electrode layerto form resistance; and a second resistance portion connected to asecond terminal including the second electrode layer and the thirdterminal to form resistance, and the first and second resistanceportions are disposed to be spaced apart from each other.
 5. Theresistor of claim 4, wherein the first electrode layer covers one endportion of the first resistance portion in a length direction of thebase substrate and a portion of the one surface of the base substrateadjacent to the one end portion of the first resistance portion, and thesecond electrode layer covers one end portion of the second resistanceportion in the length direction of the base substrate and a portion ofthe one surface of the base substrate adjacent to the one end portion ofthe second resistance portion.
 6. The resistor of claim 5, wherein thethird electrode layer covers the other end portion of the firstresistance portion in the length direction of the base substrate, theother end portion of the second resistance portion in the lengthdirection of the base substrate, and a portion of the one surface of thebase substrate exposed between the first and second resistance portions.7. The resistor of claim 1, wherein the first to third electrode layersare disposed after the resistance layer is formed.
 8. The resistor ofclaim 1, wherein the resistance layer comprises: a first resistanceportion connected to a first terminal including the first electrodelayer and a third terminal including the third electrode layer to formresistance; and a second resistance portion connected to a secondterminal including the second electrode layer and the third terminal toform resistance, and a resistance value of the other resistance portionis determined by trimming the other resistance portion in accordancewith a resistance value of one of the first and second resistanceportions determined by trimming.
 9. The resistor of claim 1, furthercomprising a protection layer disposed on a surface of the resistancelayer exposed among the first to third electrode layers.
 10. A method ofmanufacturing a resistor, the method comprising: preparing a basesubstrate; forming a resistance layer on one surface of the basesubstrate; and forming first to third electrode layers to cover portionsof the resistance layer.
 11. The method of claim 10, wherein the firstto third electrode layers are formed on one surface of the resistancelayer.
 12. The method of claim 10, wherein the resistance layercomprises: a first resistance portion connected to a first terminalincluding the first electrode layer and a third terminal including thethird electrode layer to form resistance; and a second resistanceportion connected to a second terminal including the second electrodelayer and the third terminal to form resistance, and the first andsecond resistance portions are formed integrally with each other. 13.The method of claim 10, wherein the resistance layer comprises: a firstresistance portion connected to a first terminal including the firstelectrode layer and a third terminal including the third electrode layerto form resistance; and a second resistance portion connected to asecond terminal including the second electrode layer and the thirdterminal to form resistance, and the first and second resistanceportions are disposed to be spaced apart from each other.